Laser marking machine has obvious advantages, such as high marking accuracy, not easy to erase and fast marking speed. It first entered various industries. In the semiconductor industry, it is naturally inseparable from the label.
However, wafer level marking is one of the special needs of the semiconductor industry. Wafer level marking is mainly applied to the wafer marking on the chip of each chip on the back of the wafer to ensure the traceability of each chip, and then cut into a single chip after marking.
Because the wafer has been completed in the process of the marking machine, the wafer has been very valuable. Therefore, higher requirements are put forward for the marking equipment, mainly reflected in:
(1) Wafers tend to be thinner and lighter. Different materials need to be marked with depth control and clear font;
(2) The smaller the wafer size, the larger the positioning accuracy and font size.
(3) In the process of marking, the transport and transportation of thin wafers become very difficult, and how to deal with this process becomes very important. In recent years, due to the rise of wafer level WL-CSP packaging, the demand for wafer level marking has become increasingly strong. Well known laser equipment companies at home and abroad have also developed wafer level identification equipment and substitutes.
Of course, in addition to wafer level marking, there are many other marking applications in the laser marking machine industry, such as marking the package surface after packaging, marking the serial number of the wafer, and so on.