Ceramic circuit board is widely used in 3C electronic industry because of its strong mechanical stress, good thermal cycling performance and excellent electrical insulation performance. Because of its high hardness and stronger fragility, it is difficult to cut the ceramic substrate. Traditional cutting methods mainly include: water jet cutting, laser cutting, etc., and their cutting processes have advantages and disadvantages.
Water jet cutting is a method of cutting with high-pressure water flow, which belongs to cold cutting. Laser cutting is a method of using high-energy laser beam to irradiate the product surface to form a high-temperature area for cutting. It is a kind of thermal cutting. Today, I will give you a detailed analysis of the advantages and disadvantages of the two different cutting methods.