With the gradual maturity and stability improvement of ultraviolet laser, the laser processing industry has changed from infrared laser to ultraviolet laser. At the same time, the application of ultraviolet laser is more and more popular, and the application of laser is more and more extensive.
UV laser wafer cutting: the surface of sapphire substrate is hard, the general cutter wheel is difficult to cut, and the wear is large, the yield is low, and the cutting channel is more than 30 μ m. It not only reduces the use area, but also reduces the product output. With the promotion of blue and white LED industry, the demand for sapphire substrate wafer cutting has increased significantly, and higher requirements have been put forward for improving productivity and product qualification rate.
UV laser cutting, the application of electronic ceramics has gradually matured in the last century, and its application range is also more and more wide, such as heat dissipation substrate, piezoelectric materials, resistors, semiconductors, biology, etc. in addition to traditional ceramic production processes, ceramic processing has also entered the laser processing industry with the increase of application types. According to their material types, they can be divided into functional ceramics, structural ceramics and bioceramics. Lasers that can be used to process ceramics include CO2 laser, YAG laser, green laser, etc. However, with the gradual miniaturization of components, UV laser has become a necessary processing method and can be used to process a variety of ceramics.
Laser cutting machine
UV laser glass cutting, led by the rise of smart phones, the application of UV laser has gradually developed space. In the past, due to the limited functions of mobile phones and the high cost of laser processing, laser processing played a small role in the mobile phone market. However, smart phones now have many functions and high integration. Dozens of sensors and hundreds of functional devices need to be integrated in a limited space, and the component cost is high. Therefore, the precision, yield and processing requirements are greatly improved. Ultraviolet laser has developed a variety of applications in the mobile phone industry.
UV laser ITO dry etching, the biggest feature of smart phones is the touch screen function. The capacitive touch screen can achieve multi-point touch, corresponding to the resistive touch screen, with longer life and faster response. Therefore, the capacitive touch screen has become the mainstream of smart phone selection.
UV laser circuit board cutting: the circuit board adopts laser cutting, which was first used for flexible circuit board cutting. Due to the wide variety of circuit boards, the early processing adopts mold molding, but the mold manufacturing cost is high and the production cycle is long. Therefore, UV laser processing can avoid the mold manufacturing cost and production cycle, and greatly improve the sample manufacturing time.