When consulting about the use of PCB laser cutting machine, many customers often ask what type of laser cutting machine is used for PCB, how large the size can be processed, how the processing effect is, how fast the laser cutting PCB is, and how the price is. Laiser laser introduces these problems from the principle of PCB laser cutting machine to help the guests initially understand the use of PCB equipment and have a preliminary understanding of subsequent samples and tests.
The materials of PCB printed circuit board are divided into technical substrate and composite substrate, usually including copper substrate, aluminum substrate, glass fiber substrate, epoxy resin, etc. different materials are different in selection. For example, QCW or continuous infrared laser cutting machine is usually used for copper substrate and aluminum substrate, and focal head penetration cutting is supplemented by auxiliary gas (nitrogen, oxidation, argon, air) cutting, Green laser cutting machine and ultraviolet laser cutting machine are generally used for non-metallic materials such as glass fiber board. Principle analysis of laser used in UV laser cutting PCB equipment.
Research and application of laser cutting machine:
PCB UV laser cutting equipment refers to the use of 355 UV beams to focus a light spot less than 20 microns through optical devices such as beam expander, vibrating mirror and focus lens, and control the deflection of XY motor of vibrating mirror through software to move the light spot within the scanning range of the focusing mirror. By controlling the movement mode of the light spot, the material is scanned once within a certain range, and then a layer of the material surface is peeled off to realize the cutting of the material. However, when the lens scanning range is exceeded, it is necessary to control the movement mode of the XY linear motor of the material placement platform for processing. According to the size of the material, XY type or XY type platform structure can be selected. In general, the focal length of the z-axis linear motor can be adjusted according to the material thickness. The focal depth of the UV laser cutting machine is relatively short, and the focal length needs to be adjusted at any time according to the processing requirements. For example, when cutting FPC flexible circuit board and cutting 2mm hard board, the focal length difference needs to be adjusted.
That is to say, the UV laser cutting machine is a comprehensive set of optical, electromechanical and information equipment. The equipment structure is composed of UV, XY linear workbench, driving device, industrial control computer, high-speed lens, system control software, positioning system, dust collection system, vacuum cleaner, external optical path, machine, etc.
Influence of laser cutting on PCB:
The effect of PCB in UV laser cutting is closely related to laser parameters, optical path devices, processing speed and other factors. Generally, UV laser cutting machine is required to have high frequency, narrow pulse width and large single pulse energy. High precision devices shall be used as far as possible. From the experience of laiser laser, the laser cutting PCB usually has slight carbonization on the cutting section, but it does not affect its anti-oxidation performance. To achieve complete non carbonization, the cutting speed must be reduced and the cooperation of customers is required.
PCB laser cutting
UV laser cutting printed circuit board:
The cutting speed of UV laser has a great relationship with power and material thickness, and the cutting effect also needs to be considered. Generally speaking, the higher the UV power, the faster the cutting speed, the thinner the thickness, and the faster the cutting speed.
Some customers asked how long the cutting speed can cut in one second, and whether it can reach the speed of 80mm / s of the milling cutter. Here, laiser laser also brought us a concept. UV laser cutting PCB is not direct cutting, but scanning cutting. For example, 18W optical head, 100mm lens and FR4 of cutting optical head are used. The cutting speed is generally between 20-30mm / s. The specific algorithm is an estimated price. In comparison, 100mm FR4 needs to be cut, scanned for 30 times, with 80% power, cutting speed of 3000mm / s, and then changed to 30mm / s. The actual cutting speed needs to be determined according to the test proofing. These speeds can only be used as reference, not as actual indicators. A more reasonable indicator is to calculate the processing speed according to the processing rhythm of each small piece in each batch. The rhythm of the production line, the processing effect and the cost calculation of the equipment shall be comprehensively considered.
Laser cutting of circuit board
PCB equipment UV laser cutting price:
The price issue has always been a common topic. Our manufacturer of UV laser cutting machine is to help customers select models, cooperate with the development of customers, and provide solutions. After the investigation, customers need to have a budget target, which is determined according to the actual needs. At the same time, we also need to consider the service life, maintenance costs and other issues.