Picosecond laser cutting machine is mainly composed of picosecond laser, optical guide, focusing system, displacement platform, computer control system and other auxiliary systems. Picosecond laser belongs to ultra-short pulse laser with high peak rate.

1, in the field of industrial microprocessing, picosecond lasers have begun to be used in large quantities, the main application areas of picosecond lasers are concentrated in brittle material processing, such as cell phone LCD screen shaped cutting, cell phone camera sapphire cover cutting, cell phone camera glass cover cutting, special material marking, anti-counterfeiting dazzle color marking traceable glass invisible two-dimensional code marking, heat-sensitive thin film material processing, high-performance FPC cutting OLED material cutting and punching, solar PERC cell processing and other applications.

2, picosecond laser applications in scientific research, mainly focused on micro-nano processing, multi-photon imaging, nonlinear optics, pumping detection and other application areas. The single pulse energy ranges from a dozen microjoules to several hundred microjoules, and the applicable materials are very wide, mainly focusing on brittle glass, ceramics, sapphire, silicon nitride, wafers, metals and composite thin film materials and so on.

3, in the field of aerospace, picosecond laser with high efficiency, low energy consumption, short process, good performance, digitalization, intelligence and other characteristics. Currently the application field focuses on hard-to-machine materials class of high-performance parts, ultra-high-precision class of high-performance parts and cross-scale effect to achieve high performance parts; hard-to-machine materials class of high-performance parts, such as aero-engine hot-end parts of the air-film cooling holes processing, picosecond laser in the air-film holes processing quality control and the ability to process the shaped holes has a relative advantage.

Picosecond ultraviolet laser cutting machine is suitable for ultra-thin metal materials (copper, gold, silver, aluminum, titanium, nickel, stainless steel, molybdenum, etc.), flexible materials (PET, PI, PP, PVC, Teflon, electromagnetic film, adhesive film, etc.), graphene, carbon fibers, silicon wafers, ceramics, FPC and other materials, such as cutting, perforation, surface microstructures (biomimetic structure), scribing, groove engraving processing, as well as polymers, composite materials microfabrication of polymer materials and composite materials, etc.