What is UV laser cutting machine? It refers to the use of 355nm wavelength UV laser, through 10 times the beam expander mirror, through the vibrating mirror focus a point work to the surface of the workpiece, through the high energy beam instantly gasification of the surface of the workpiece, the formation of the purpose of cutting. In addition on the addition of automatic identification and positioning system, can realize automatic cutting, installation of marble working platform to ensure the stability of the structure, linear motor platform, to ensure a larger processing width, to meet industrial needs.

FPC profile UV laser cutting

FPC flexible board is an important connection line in the cell phone circuit board, carrying the carrier of the confidence spread, usually used in the cell phone battery and circuit board links, camera and circuit board links, gold finger FPC connection board, the requirements of the cutting needs to be neat edges, no carbonization, no overflow of glue, neat edges, no burrs, so the cold light source of the ultraviolet laser cutting machine is particularly suitable for FPC profile cutting. Cutting samples are as follows:

Brittle glass UV laser cutting

Glass is a kind of brittle material, after the cutting is completed, but also to test his strength, which is not only the need for fast cutting speed, cutting edges flush, the need for its chipping the size of the extremely high requirements. There is no doubt that the UV laser cutting machine is the most effective way to cut glass, but the thickness of the UV laser cutting machine can be cut glass is very thin, temporarily only used in high-end areas, such as consumer electronics, military industry, etc.. Beyond the laser cutting of thin glass cutting speed, chipping small, neat edges, is widely used in the field of cell phones, military industry.

Ceramic UV laser cutting

Ceramic material as PCB substrate material is a high-end material, UV laser ceramic cutting, a wider range of applications, such as heat dissipation substrate, piezoelectric materials, resistors, semiconductor applications, biological applications, etc. In addition to the traditional ceramic processing process, ceramic processing is also due to the increase in the types of applications, and then into the field of laser processing. Ceramics can be categorized into functional ceramics, structural ceramics, and bioceramics according to the type of material they are made of. The lasers that can be used to process ceramics are CO2 lasers, YAG lasers, green lasers, etc. However, with the gradual miniaturization of components, UV laser processing has become a necessary processing method, and multiple types of ceramics can be processed. The UV laser cutting machine is more widely used in soft ceramics and soft and hard combination of ceramics, cutting edge neat, fast cutting speed, no carbonization.

 UV laser wafer cutting, sapphire substrate surface is hard, the general knife wheel is difficult to cut it, and abrasion, low yield, the cutting channel is greater than 30 μm, not only reduces the use of the area, but also reduces the yield of the product. Driven by the blue and white LED industry, the demand for sapphire substrate wafer cutting has increased dramatically, and higher requirements have been put forward for improving productivity and qualified rate of finished products.