In the copper foil cutting, nowadays the better processing technology is laser cutting, which has to mention the UV laser cutting machine nowadays red all over the big and small manufacturers, its principle is the use of semiconductor ultraviolet laser, through the use of galvanometer high energy beam scanning back and forth to realize the cutting way. The advantages of the UV laser cutting machine lies in its use of the laser as a cold light source, the thermal impact on the processed material is small, small processing gap, smooth processing edges, no burr, especially for thin metal materials cutting, such as copper foil, thin metal alloys, and so on.

Copper foil is also one of the common components in electronic applications, it is an anionic electrolytic material, precipitated on the circuit board substrate layer of a thin, continuous layer of metal foil, which serves as a conductor of electricity on the circuit board. Copper foil is a very thin copper product. Copper like paper, its thickness is expressed in microns. Generally between 5um-135um, the thinner and wider the more difficult to produce Simply put, the copper pressed into a very thin sheet, is the copper foil.

The difficulty of cutting copper foil lies in the fact that the cutting edge is free of carbonization and burrs, which will not deform the copper foil and realize the roll-to-roll processing mode. General laser cutting machine thermal impact is large, and the application of different directions, precision is relatively low compared to the UV laser cutting machine, the edge of the carbonized eyes, the edge of the thermal impact of the copper foil will be warped deformation.

The processing mode of UV laser cutting machine adopts galvanometer scanning mode, the bottom adopts vacuum adsorption, the cold light source reduces the thermal influence, realizes the perfect cutting of copper foil, also applies to the ultra-thin metal cutting.

Through the advantages of the ultraviolet laser cutting machine, the major manufacturers of its wide range of applications, from thin metal to ultra-thin metal, from precision cutting to micro-precision cutting, laser processing technology is still in constant innovation and development, the future market will continue to expand.