Ultra-fast laser is a laser pulse with a time width of femtosecond or picosecond class, relying on its own extremely high peak power to instantly vaporize matter. Compared with nanosecond laser or continuous laser, the thermal effect is smaller and the processing edge is neat, which is ideal for cutting and processing applications of products such as cell phone glass screen sapphire and diamond superconducting materials!

Full-screen has become a trend, major cell phone manufacturers such as Apple, Samsung, Huawei, Xiaomi have launched their own full-screen products.

Full screen generally refers to the screen of the cell phone screen accounted for more than 80%, is the inevitable result of narrow bezel to achieve. Conventional cell phone screen aspect ratio of 16:9, is rectangular, the four corners are right angle. Because the body to install the front camera, range sensor, earpiece and other components, so the screen and the upper and lower body edges have a certain distance. Narrowing and reducing the upper and lower bezels requires a redesign of the entire front part of the phone, which is very difficult. And since the display area of full-screen phones is getting larger and larger, the right angle of the display area is getting closer to the rounded distance from the edge of the phone, and close proximity can easily cause damage. Therefore, in order to reduce the possibility of breaking the screen, it is especially important to reserve the component space and cut the screen into non-right-angle shaped. Ultra-high speed laser cutting has high cutting size accuracy, no deformation of the cutting seam, no burr cutting, no taper cutting, fast cutting speed, high cutting rate, and can achieve arbitrary graphics cutting, which has obvious advantages compared to knife wheel cutting, CNC grinding and other processing methods. The current cell phone full-screen shaped cutting mainly involves L angle, C angle, R angle, U groove cutting.

Known as the "king of materials" diamond well deserved, its hardness can be imagined, and then the diamond processing equipment to put forward higher requirements, diamond is also the best superconducting materials, in high-end products, its role can not be measured in money, ultrafast laser in the diamond cutting thinning has an irreplaceable role. Especially with superconducting materials prevailing (as above), in the 1MM thickness interface 20UM ultra-fine cut cutting molding, only ultrafast laser can complete, especially with ultrafast picosecond ultraviolet laser in cold light source processing, no thermal impact, the material itself will not be damaged, the fine spot of the incision to ensure neat and smooth cutting edge.

The development of wafer industry has become a topic of concern for every Chinese. With the improvement of end product functions, the requirements for wafers are getting lighter and more intelligent, and the requirements for wafers are getting higher and higher. In the wafer V-slot is getting smaller and smaller, the process is getting more and more mature application today, the traditional knife wheel cutting and sub-nanosecond laser cutting process can no longer meet the needs of the new capacity, ultrafast laser hard cutting It is imperative that Lyser laser cutting machine is born for this purpose. It adopts ultra-fast and ultra-fine spot laser, with Lyser laser self-developed special optical system and ultra-fast beam splitting oscillator, it can realize 100 spots of simultaneous processing, the speed is not affected, the line width distance is 10UM, the perfect smooth edge is faster than the traditional cutting, and saves a lot of manpower in the process.