Laser processing of ceramic circuit boards mainly includes laser punching and laser cutting of two kinds:

Alumina-aluminium nitride and other high thermal conductivity, good insulation properties, high temperature resistance, in the electronics, semiconductors and other fields have been widely used. However, ceramic materials have high hardness and brittleness, and their molding processing is very difficult, especially the processing of micro-hole is particularly difficult. Because the laser has a high power density and good directivity, the current ceramic sheet is commonly used in laser perforation, laser ceramic perforation is generally pulsed laser or quasi-continuous laser (fiber laser), the laser beam through the optical system focused on the workpiece placed perpendicular to the laser axis, emitting a high energy density (10-10 * 9 * cm2) of the laser laser beam by the laser cutting head jet to the workpiece placed perpendicular to the laser axis placed on the workpiece, emitting a high energy density (10-10*9*cm2) laser cutting head, gradually forming a through-hole.

Ceramic Laser Cutting Scenario

 There are high requirements for speed, according to the different requirements of component applications, the micro-hole diameter range is 0.05~0.2mm. In ceramic precision processing, the general laser focal spot diameter ≤ 0.05mm, according to the different thickness size of ceramic flakes, usually the through-hole of different apertures can be achieved by controlling the amount of defocusing, for the through-hole of diameter less than 0.15mm, the hole can be achieved by controlling the amount of defocusing.

Ceramic laser cutting applications

At present, there are two main types of ceramic circuit board cutting, waterjet cutting and laser cutting, and the current laser cutting market is more about fiber laser. Cutting ceramic circuit boards with fiber laser has the following advantages:

1, high accuracy, fast speed, narrow cutting slit, small heat area, smooth cutting surface and no burr.

2, the laser cutting head and the material surface shall not contact, shall not scratch the workpiece.

3, narrow cutting slit, small heat-affected zone, small local deformation of the workpiece, no mechanical deformation. /4、With good processing flexibility, it can process any shape, also can cut pipe and other profiles.

Along with the continuous promotion of 5G construction, precision microelectronics, aviation ships and other industrial fields have also made great strides, and the application of ceramic substrates has become more and more widespread. In these areas, ceramic substrate PCBs are increasingly being used due to their excellent performance.

Ceramic substrate is the basic material for high power electronic circuit structure technology and interconnection technology, its structure is dense and has a certain degree of brittleness. Conventional processing methods for very thin ceramic sheets are subject to stress during processing and can easily produce breakage.

With the development trend of light weight and miniaturization, the conventional cutting processing methods have long failed to meet the requirements due to their low precision. As a non-contact processing tool, laser as a non-contact processing tool, it plays a very important role in the processing of ceramic substrate PCB.