Alumina, aluminum nitride and other high thermal conductivity, good insulation properties, high temperature resistance, in electronics, semiconductors and other fields have been widely used. However, ceramic materials have high hardness and brittleness, making molding and processing difficult, especially in the micro-hole processing process. Because of the high power density and good directivity of the laser, ceramic thin plates are now generally processed with laser drills, which are generally pulsed lasers or quasi-continuous lasers (fiber laser), with the laser beam placed centrally on the workpiece perpendicular to the laser axis by the optical system.

Because of the small size and high density of electronic and semiconductor components, there are high requirements for the precision and speed of laser drilling. Depending on the requirements for the use of the components, electronic and semiconductor components are small in size and high in density, so there are high requirements for the precision and speed of laser drilling. Depending on the use of the components, the diameter of the micro-hole is between 0.04 and 0.1 mm. Laser used for ceramic precision processing, general laser focus diameter ≤ 0.05mm, according to the thickness and size of the ceramic plate, you can achieve different hole diameter hole by controlling the amount of focus separation, for the diameter of less than 0.15mm hole.

There are two main types of ceramic plate cutting, waterjet cutting and laser cutting. At present, the market is widely used fiber laser for laser cutting.

 Ceramic Laser Cutting

The advantages of ceramic laser cutting machine are:

(1) Narrow kerf, high precision, small thermal interference zone, smooth and burr-free kerf surface.

(2) The laser cutting head does not touch the material surface or damage the workpiece.

(3) Narrow kerf, small thermal interference zone, small local deformation of the workpiece, no mechanical deformation.

(4) Processing flexibility, can be processed for any graphics, can also cut the pipe and other shaped materials.

Ceramic Laser Cutting

The is a high-end precision laser processing equipment developed mainly for various types of ceramic finishing, with high processing efficiency, good quality, small thermal interference zone, stress-free flexible processing, arbitrary graphics processing, CCD automatic focus, positioning, automatic box-to-box loading and unloading and other excellent features, is the ideal tool for processing ceramic materials in thick film circuits, microwave communications and other electronic components.

Along with the continuous promotion of 5G construction, there has been further development in industrial fields such as precision microelectronics and aviation ships, and the application of ceramic substrates covers these fields. In these areas, ceramic substrate PCBs are increasingly being used due to their excellent performance.

Ceramic substrate is the basic material for high power electronic circuit structure technology and interconnection technology, its structure is dense and has a certain brittleness. Conventional processing methods for very thin ceramic sheets are subject to stress during processing and can easily produce breakage.

In recent years, with the development of miniaturization and light weight, the conventional cutting processing methods cannot meet the requirements due to the low precision. As a non-contact processing tool, laser plays a very important role in PCB processing of ceramic substrates.

With the continuous development of the microelectronics industry, electronic components are gradually developing in the direction of miniaturization and thinness, which requires higher and higher precision, which inevitably puts forward higher requirements on the degree of processing of ceramic substrates. Based on this background, the application of laser ceramic substrates on PCB has a broad development prospect!