With the progress of the times, laser cutting machines have been widely used in various industries, and the development of equipment and technological updates are also becoming faster and faster. However, many customers still have many problems when cutting thick plates, as the requirements for laser cutting machines are relatively high, so high-power laser cutting machines are generally used for cutting. Although high-power laser cutting machines can be used to cut thick plates, there may still be some problems to some extent. Today, let's talk about some common problems when processing thick plates with laser cutting machines!

Thick plate perforation:

Laser perforation is the first action before cutting. The thicker the plate, the longer the perforation time. Therefore, in order to improve cutting efficiency, many laser cutting machine manufacturers will increase the perforation time. So, a common problem during perforation is bursting. The reason for this problem is the use of high-power perforation, which is fast: the huge energy injected during perforation increases the temperature of the board, affecting the overall cutting process in the future. When small power pulse is used for perforation, the time is very long, which leads to the reduction of cutting power and the increase of Unit cost.

Cutting section:

The difficulty of laser cutting thick plates is much higher than that of thin plates, and the beauty of special cutting sections is more obvious than that of thin plates, with poor accuracy. Even serious slag sticking and other phenomena may occur, which cannot fully reflect the processing value of laser cutting machines. Processing thick plates requires high requirements for laser cutting machines, so when choosing laser cutting machines, it is important to choose high-power, large brand laser cutting machine manufacturers.