Laser cutting machines, marking machines, and etching machines all perform cutting and marking operations on workpieces. Next, we will learn about their specific content from the principles, classifications, workpieces, and lasers.

Principle:

Laser cutting machine: It uses a focused high-power density laser beam to irradiate a workpiece, causing the irradiated material to quickly melt, vaporize, ablate, or reach the ignition point. At the same time, it uses a high-speed airflow coaxial with the beam to blow away the molten material, thereby achieving the cutting of the workpiece. Laser cutting is one of the thermal cutting methods.

Laser marking machine: A high-energy continuous laser beam is generated by a laser generator, and the focused laser acts on the substrate material, causing the surface material to instantly melt or even vaporize. By controlling the path of the laser on the material surface, the required graphic and textual markings are formed.

Laser etching machine: Laser utilizes high-energy, extremely short pulse laser to instantly vaporize materials without damaging surrounding materials, and can accurately control the depth of action. Therefore, making etching precise.

The principles of laser cutting, marking, and etching are the same. They are all achieved by irradiating the material surface with high energy after beam shaping, causing chemical or physical changes to form cutting, marking pattern text (marking), and etching circuit diagram (marking).

Classification:

Laser cutting machine:

1. Laser vaporization cutting

2. Laser melting cutting

3. Laser oxygen cutting

4. Laser scribing and controlled fracture

Laser marking machine:

1. CO2 laser marking machine

2. Semiconductor laser marking machine

3. Fiber laser marking machine

4. YAG laser marking machine

Laser etching machine:

1. Metal thin film laser etching machine

2. Silver slurry laser etching machine

3. ITO coating laser etching machine

Job piece:

Laser cutting machines: usually divided into several types, one is high-power laser metal cutting, such as steel plate, stainless steel plate cutting, etc; One type belongs to micro precision cutting, such as UV laser cutting of PCB, FPC, PI film, etc; One type is CO2 laser cutting of materials such as leather and cloth.

Laser marking machine: Usually a low-power laser that can use different light sources to mark two-dimensional codes, patterns, text, and other information on materials such as glass, metal, silicon wafers, and plastics.

Laser etching machine: usually used for processing conductive materials in industries such as photovoltaics and electronics, such as ITO glass etching, solar cell laser marking, etc., mainly for processing and forming circuit diagrams.

The role of lasers at different powers and frequencies:

1. Laser marking machines are generally 0-50W (with slightly higher CO2 power) and can be used to cut materials between 0.01 and 0.05mm;

2. The laser etching machine is basically around 50-100W;

3. The higher the power of the laser cutting machine, the greater the laser energy, and the greater the thickness of the cutting.

When using these machines, we need to choose the machine that is suitable for ourselves based on our own workpiece situation and the requirements we need to meet.