As an advanced means of material cutting, light processing has been increasingly accepted by the metal producers. With the continuous progress of computer control technology and optical technology, people have higher expectations for its processing ability. This expectation is not only for cutting, but also for cutting well and quickly.

At present, the demand for high-power laser cutting machines is increasing, and the demand for thick plate cutting is increasing. However, thick plate cutting has high requirements for laser cutting machines. Whether it is cutting speed or cutting section, it is a test for the technology of laser cutting machine manufacturers. What problems will be encountered in cutting thick plates? The large picture below shows you one or two.

1. Thick plate perforation

Laser perforation is the first step before cutting. The thicker the plate, the longer the perforation time, and the larger the proportion of perforation time. So in order to improve the cutting efficiency, many laser manufacturers will improve the piercing time to achieve fast piercing, but there will also be holes burst in the operation process, which is caused by the use of high power cutting machine and fast speed. On the contrary, the use of low power pulse piercing will lead to long cutting time, power reduction and high unit cost.

2. Cutting section quality problem

The difficulty of laser cutting thick plate is much higher than that of thin plate, and the beauty of section is more obvious than that of thin plate. Therefore, the cutting section often encountered when processing medium and thick plates is not only questioned about the quality of the finished products, but also accompanied by excessive burning and serious slag, so that the processing value of the laser cutting machine cannot be fully reflected.

3. The stability of the whole plate batch processing

In the whole sheet metal processing, sometimes the phenomenon of poor processing in local areas will occur randomly, even when the processing machine is in good condition. Dealing with local processing problems will also affect the overall processing progress.