1、 The difference between the core component laser:
1. Optical fiber laser marking machine: 1064nm wavelength is used. As for the laser wavelength, the shorter the wavelength is, the smaller the laser spot will be, the higher the precision will be, the smaller the heat affected zone will be formed during processing, and the more exquisite the processing effect will be.
2. Ultraviolet laser marking machine: It is developed by using a 355nm wavelength ultraviolet laser. Compared with infrared laser, the model uses third-order intracavity frequency doubling technology. The 355 ultraviolet focused spot is very small, which can greatly reduce the mechanical deformation of materials and has little impact on processing heat.
2、 What are the differences between processing methods
1. The processing method of ultraviolet laser marking machine is different from that of other laser marking equipment. Generally, CO2 laser marking machine and optical fiber laser marking machine are both physical marking methods for laser, while ultraviolet laser marking machine uses chemical processing method, mainly photochemical reaction. The difference between the two processing methods is that laser physical processing method is mainly used to process the surface of products and materials, The laser chemical processing method can use laser to go deep into the interior of product materials for processing.
2. Based on the different working principles and processing methods of the two laser marking machines, there are also some differences in their application fields. Fiber laser marking machines are suitable for laser marking on various metal surfaces. Because its beam generates heat, it is not suitable for marking of high-precision special materials.
Ultraviolet laser marking machine: It is especially suitable for the high-grade market of super fine processing. The packaging bottle surface of cosmetics, drugs, videos and other macromolecular materials is marked with fine effect, and the marks are firmly cleaned, which is superior to ink spraying and free of pollution; Marking and scribing of flexible pcb boards; Micro hole and blind hole processing of silicon wafer. Among them, 80% of the data lines and adapters on the market are marked by ultraviolet laser.