More and more processing enterprises introduce FPC covering film laser cutting into production. FPC covering film laser cutting machine has the following advantages:
1. Nanosecond ultraviolet laser, cold light source, laser cutting heat affected zone is especially small to 10 μ m;
2. It is equipped with domestic or imported lasers, with good beam quality, fine facula, fine slitting and high cutting accuracy;
3. Numerical control feeding structure, accurate cutting, high precision and fast speed;
4. The minimum focusing spot can reach 10 μ m. Suitable for micro cutting drilling of any organic&inorganic materials;
5. CCD vision pre scanning&automatic target grabbing positioning, maximum processing range 500mm × 350mm, XY platform splicing accuracy ≤± 5 μ m;
6. Support multiple visual positioning features, such as cross, solid circle, hollow circle, L-shaped right angle edge, image feature points, etc;
7. The manipulator automatically loads and unloads the material, and cuts the IC fingerprint identification chip, which takes 3 seconds for a single chip;
8. Double "enjoyment" of operation efficiency, and take into account the functions of automatic counting and model conversion, further upgrading the processing quality management;
9. More than ten years of professional R&D and design technology accumulation of laser micro processing system, stable performance, and no consumables.