Glass is an important industrial material. Due to its brittle material, it is easy to be broken by external forces during processing. For example, mechanical stress and thermal influence can make glass crack, so the precision of glass processing is required to be very high. Different from the traditional mechanical cutting method, the energy of the laser beam is used to cut the glass in a non-contact way. This energy heats a specific part of the workpiece to a pre-defined temperature. The rapid heating process is followed by rapid cooling, so that a vertical stress band is generated inside the glass, and a crack without chips or cracks appears in this direction. Because cracks are generated only by heating, not by mechanical reasons, there will be no serious debris and microcracks
Therefore, the intensity of laser cutting edges is stronger than that of traditional scoring and segmentation methods. The accuracy and efficiency have also been greatly improved. In addition, the occurrence of glass fragments can also be completely avoided. This CY-PSGA-6030 model, which is mainly aimed at high-end precision cutting, is widely used in sapphire substrate/glass laser cutting, drilling, and the section is flat and smooth. The disadvantages of traditional processing have been greatly improved.
CY-PSGA-6030 Glass Laser Cutting Machine Model Features:
1. High performance infrared picosecond laser is adopted, with good laser beam quality, high peak power, narrow pulse width and high pulse stability;
2. The focus spot is small, the incision is narrow, the cutting edge is flat, the edge collapse is small, the processing speed is fast, and the processing quality and stability are guaranteed;
3. Advanced Bessel cutting technology is adopted, with high speed and precision (equipped with CO2 laser slice);
4. It is equipped with industrial special control equipment, and the whole process is automatically controlled by computer software, which can operate for a long time;
5. The non-contact laser processing mode has no stress on the processing materials, and can process various special-shaped holes and micropores. It is suitable for fine cutting of mobile phone cover, optical glass, sapphire substrate, and electric plate glass materials.