Picosecond cutting can obtain very high peak light intensity with low pulse energy. At the same time, it uses the characteristics of low thermal energy diffusion to complete the material interruption before the heat conduction to the surrounding materials, so as to achieve high-precision cutting. It shows good results in the cutting of brittle materials.
The interaction time between the ultrashort laser pulse and the material is extremely short. When the laser pulse width reaches the order of picosecond or femtosecond, it can largely avoid the impact on the thermal movement of molecules and will not bring thermal impact to the surrounding materials. Therefore, the ultra fast laser processing is also called cold processing.
Picosecond laser "cold processing" can reduce the melting and heat affected zone. The heat affected zone is small, the slit width is small, and there is less recasting material. It has better surface ablation quality. The absorption of laser energy is less dependent on the material and wavelength. It has the characteristics of low heat, cold ablation, high precision, etc. It is suitable for material finishing.
It can also control the depth of cutting, and has strong processing flexibility. It can achieve micro size cutting, and can also fine cut any shape; It is characterized by automatic target grasping and positioning, automatic loading and unloading, short time consumption, simple operation and labor saving.